| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package having a high strength to a local external stress, and a low cost for a board packaging. SOLUTION: The semiconductor package of a tape type BGA package is composed of a glass cloth epoxy resin 8 adhering to the rear surface of a semiconductor chip 1 (the surface opposite to the surface with a bonding pad 2 of the semiconductor chip 1 formed thereon) by an adhesive agent 9, and of an epoxy resin 10 covering the peripheral part of the chip 1 and the resin 8. COPYRIGHT: (C)2007,JPO&INPIT
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