| 摘要 |
PROBLEM TO BE SOLVED: To provide a device manufacturing apparatus for manufacturing a device with desired precision by preventing the occurrence of any failure such as the clogging of the nozzle of an ejection head due to drying, and realizing a stabilized drop ejecting operation. SOLUTION: A device manufacturing apparatus IJ is provided with a stage ST for supporting a substrate P, an ejection means 20 having a head part capable of ejecting a fluid containing conductive materials to the substrate P, a preliminary ejection area 52 installed in the stage ST and a controller CONT for controlling the ejecting operation of the ejecting means 20 to eject the fluid to the preliminary ejection area 52 before ejecting the fluid to the substrate P. COPYRIGHT: (C)2007,JPO&INPIT
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