| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for controlling occurrence of a trouble such as cracking of a thin film element layer in a thin film device where a substrate and the thin film element layer are bonded through adhesive. SOLUTION: The thin film device comprises a substrate (22), an adhesive layer (24) provided on one surface of the substrate, a thin film element layer (14) including a thin film element and bonded to one surface side of the substrate by the adhesive layer, and a protective layer (16) composed of a material having a thermal expansion coefficient substantially equal to that of the constitutional material of the substrate and covering the upper side of the thin film element layer substantially entirely. COPYRIGHT: (C)2007,JPO&INPIT
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