发明名称 GRINDING PROCESSING METHOD AND GRINDING PROCESSING DEVICE OF FORMING DIE OF MICRO LENS ARRAY
摘要 PROBLEM TO BE SOLVED: To highly accurately and uniformly grind and process a recessed part of a spherical shape having a predetermined radius of curvature and surface accuracy on a molding surface. SOLUTION: This grinding processing device has a main spindle 7 for installing a work, a grinding spindle 9 slantingly arrangeable to the main spindle 7, a grinding wheel 13 installed on the grinding spindle 9, a grinding spindle holder 12 for substantially integrally revolving and moving the grinding wheel 13 with the work in a state of setting a distance between the main spindle 7 and the processing center of the work substantially constant by pushing the grinding wheel 13 against the work, and a sensor 35 for measuring dimensional accuracy of the processed recessed part of the spherical shape. An inclination of the grinding spindle 9 is corrected by feeding back a measuring result by the sensor 35 to a rotary table 10 via a control part 36. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006289566(A) 申请公布日期 2006.10.26
申请号 JP20050115250 申请日期 2005.04.13
申请人 OLYMPUS CORP 发明人 CHIAKI SHUNJI
分类号 B24B13/00 主分类号 B24B13/00
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