发明名称 Electronic component, has spring unit establishing electrical connection between board and support unit, mechanically and electrically connected with board or support unit and lying against support unit or board in prestressed manner
摘要 <p>The component has a spring unit (6) provided for establishing an electrical connection between a printed circuit board (2) and a support unit (5) supporting a semiconductor unit (4). The unit (6) is mechanically and electrically connected with the circuit board or the unit (5) by reflow soldering and lie against the unit (5) or circuit board at an electrical contact point (7) in a prestressed manner, where the unit (6) is designed as a helical spring. An independent claim is also included for a method for establishing an electric connection between a printed circuit board and a support unit supporting a semiconductor unit in an electronic component.</p>
申请公布号 DE102005017849(A1) 申请公布日期 2006.10.26
申请号 DE20051017849 申请日期 2005.04.18
申请人 SIEMENS AG 发明人 BAUDELOT, ERIC
分类号 H01L23/48;H05K3/32 主分类号 H01L23/48
代理机构 代理人
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