| 摘要 |
<p>A packaging system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The packaging system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a substrate heating/heat insulating stage heater is provided, respectively, at a substrate conveying portion from the substrate waiting stage for the chip mounting section to the chip mounting section, the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulation of the substrate together with the substrate magazine capable of containing a plurality of substrates whereupon chips are mounted. The substrate can be sustained at a desirable temperature over the substantially entire packaging process having a series of steps and problems especially incident to moisture absorption can be suppressed or prevented.</p> |
