发明名称 CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT
摘要 <p>Disclosed is a curing accelerating compound-silica composite material obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water. The curing accelerating compound-silica composite material gives excellent storage stability to a curable resin composition. Also disclosed are a curable resin composition containing such a curing accelerating compound-silica composite material, and an electronic component comprising a device sealed with such a resin composition. R<SUP>1</SUP></p>
申请公布号 WO2006112396(A1) 申请公布日期 2006.10.26
申请号 WO2006JP307943 申请日期 2006.04.14
申请人 HITACHI CHEMICAL CO., LTD.;NAKAMURA, SHINYA 发明人 NAKAMURA, SHINYA
分类号 C08G77/06;C08G59/68;H01L23/29;H01L23/31 主分类号 C08G77/06
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