发明名称 |
CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT |
摘要 |
<p>Disclosed is a curing accelerating compound-silica composite material obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water. The curing accelerating compound-silica composite material gives excellent storage stability to a curable resin composition. Also disclosed are a curable resin composition containing such a curing accelerating compound-silica composite material, and an electronic component comprising a device sealed with such a resin composition. R<SUP>1</SUP></p> |
申请公布号 |
WO2006112396(A1) |
申请公布日期 |
2006.10.26 |
申请号 |
WO2006JP307943 |
申请日期 |
2006.04.14 |
申请人 |
HITACHI CHEMICAL CO., LTD.;NAKAMURA, SHINYA |
发明人 |
NAKAMURA, SHINYA |
分类号 |
C08G77/06;C08G59/68;H01L23/29;H01L23/31 |
主分类号 |
C08G77/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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