| 摘要 |
A semiconductor device module is provided to efficiency radiate the heat in a small space between modules to the outside by improving the quantity and flowrate of the air between the modules even if a plurality of modules are disposed as an array. A circuit is designed in a printed circuit board(13). A plurality of semiconductor packages(15) are mounted on the upper surface of the printed circuit board, electrically connected to the circuit. A plurality of connection terminals(17) are formed under one side of the printed circuit board, electrically connected to the semiconductor package through the circuit. A thermal diffusion apparatus(19) includes two thermal diffusion plates(21) and an air duct(25). The thermal diffusion plates come in contact with the semiconductor package and the lower surface of the printed circuit board correspondingly. The air duct is formed on the other side of the printed circuit board, connected to the thermal diffusion plate and made of both wing types of a bird wherein the wing types are sloped upward with respect to the center part of the wing types. The thermal diffusion apparatus includes a body made of metal like aluminum or copper having excellent heat conductivity characteristic.
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