| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small-sized semiconductor apparatus with bus bars and plural terminals for signal input and output to which a semiconductor device is bonded. <P>SOLUTION: The small-sized semiconductor apparatus is equipped with semiconductor chips 101, 104; bus bars 6c, 6ec to which the semiconductor chips 101, 104 are face-bonded through a conductive bonding material 3; terminal groups 51, 52 connected to the semiconductor chips 101, 104 and the bus bars 6c, 6ec for inputting or outputting signals from these semiconductor chips 101, 104 and these bus bars 6c, 6ec; and resin mold 7 which is integrated with the bus bars 6c, 6ec and the terminal groups 51, 52. The terminal groups 51, 52 comprise the first terminal 51 which is connected to the semiconductor chips 101, 104 through a bonding wire 4; and the second terminal 52 which is integrated with the bus bars 6c, 6ec. <P>COPYRIGHT: (C)2007,JPO&INPIT |
