发明名称 THIN FILM BONDED BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide a single crystal thin film substrate which is used as a substrate for manufacturing a semiconductor element such as a light emitting element excelling in luminous efficiency, and which comprises as main components gallium nitride, indium nitride, and aluminum nitride. <P>SOLUTION: A highly crystalline single crystal thin film comprising as the main components one or more sorts selected from among gallium nitride, indium nitride and aluminum nitride is formed by using a sintered compact composed mainly of a ceramic material, especially a translucent sintered compact. An electronic element and an electronic component are manufactured using a bonded body of the single crystal thin film and the sintered compact. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006290729(A) 申请公布日期 2006.10.26
申请号 JP20060065203 申请日期 2006.03.10
申请人 MIYAHARA KENICHIRO 发明人 MIYAHARA KENICHIRO
分类号 C30B29/38;C04B35/08;C04B35/58;C04B35/581;C04B41/87;C23C16/34;C30B25/18;G02B6/12;H01L33/06;H01L33/32;H01L33/40;H01S5/343 主分类号 C30B29/38
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