| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board which provides a stable connection resistance. <P>SOLUTION: A non-compressive base 1 which is hardened by heating and pressing a composite material consisting of a woven fabric or an unwoven fabric and a thermosetting resin, is manufactured. Next, a double-sided circuit board 20 is obtained by forming through-holes 4 in the base 1 having releasing films 3, bonded through adhesive layers 2 to both sides, filling a conductive paste 5 in the through-holes 4; peeling the releasing films 3 off; laminating metal foils 6a, 6b on both sides of the base 1; heating and pressing them with a heat press to harden the adhesive layers 2, thereby bonding the foils 6a, 6b to the base 1; connecting them electrically with the conductive paste 5; and selectively etching the foils 6a, 6b to form circuit patterns 7a, 7b. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
