发明名称 PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board suppressing resonance between a power source and a ground layer, and having the high degree of freedom in design, and also to provide a manufacturing method thereof. SOLUTION: The printed wiring board 10 has power source layers 13, 15 and ground layers 12, 14, 16. In the printed wiring board 10, a coupling shielding layer 22 including a magnetic metal material is provided between the power source layer and the ground layer. The method of manufacturing the printed wiring board 10 has a process in which a coupling shielding film 20 having the coupling shielding layer 22 formed on the surface of a resin film 21 is arranged between a plurality of metallic foils to be used as the power source layer and the ground layer. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006294967(A) 申请公布日期 2006.10.26
申请号 JP20050115520 申请日期 2005.04.13
申请人 SHIN ETSU POLYMER CO LTD 发明人 ODAJIMA SATOSHI;KAWAGUCHI TOSHIYUKI;TAWARA KAZUTOKI;SAGA TSUTOMU
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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