发明名称 |
Flip-chip devices formed on photonic integrated circuit chips |
摘要 |
Various embodiments include optically aligning and connecting optical devices to optical grating couplers using a variety of bonding techniques, as a means of transferring optical signals to and from optoelectronic integrated circuits.
|
申请公布号 |
US2006239612(A1) |
申请公布日期 |
2006.10.26 |
申请号 |
US20050195357 |
申请日期 |
2005.08.02 |
申请人 |
|
发明人 |
DE DOBBELAERE PETER;GLOECKNER STEFFEN;MEREL ROGER;KOUMANS ROGER;GUNN LAWRENCE C.III;PINGUET THIERRY J.;RATTIER MAXIME J. |
分类号 |
G02B6/34;G02B6/12;G02B6/26;G02B6/42 |
主分类号 |
G02B6/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|