| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce an installation space and an electric capacity of a hot water supply device using a heat pump as a heat source. <P>SOLUTION: This hot water supply device 1 is provided with a first refrigerant circuit 11, a second refrigerant circuit 9, a first thermal storage unit 39, a second thermal storage unit 37, and a hot water supply circuit 13. A low-melting point first latent heat thermal storage material is stored in the first thermal storage unit 37. A high-melting point second latent heat thermal storage material is stored in the second thermal storage unit 37. A first heat regenerator 47 for the first refrigerant circuit 11 is arranged in the first thermal storage unit 39. A second heat regenerator 41 for the second refrigerant circuit 9 is arranged in the second thermal storage unit 37. <P>COPYRIGHT: (C)2007,JPO&INPIT |
