| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, prepreg, a metal-coated laminate board and a wiring board, which are excellent all in dielectricity, heat resistance, moisture resistance, anti-corrosiveness, adhesion to a copper foil, chemical resistance and fire-retardancy by a non-halogen fire-retarding agent. SOLUTION: The thermosetting resin composition comprises (A) an isocyanate compound containing 2 or more isocyanate groups per molecule, (B) an epoxy resin containing 2 or more epoxy groups per molecule, (C) a metal salt of a 2-substituted phosphinic acid and a polyphosphazene compound as a fire-retardant, (D) a silicone polymer which contains a 3-functional siloxane unit shown by the formula of RSiO<SB>3/2</SB>(wherein R may be the same or different) and a 4-functional siloxane unit shown by the formula of SiO<SB>4/2</SB>, has a degree of polymerization of 7,000 or less and contains one or more functional groups reactive with a hydroxy group at a terminal position, and (E) an inorganic filler. COPYRIGHT: (C)2007,JPO&INPIT |
