| 摘要 |
PROBLEM TO BE SOLVED: To provide equipment and method for cleaning a semiconductor substrate. SOLUTION: The equipment for cleaning a semiconductor substrate such as a wafer (W) comprises a processing chamber 100, a rotatable supporting section 200 arranged in the processing chamber 100 and being arranged with the semiconductor substrate, a nozzle 400 for supplying organic solvent, and a dry gas supply nozzle 500 for supplying organic solvent in vapor state into the processing chamber. COPYRIGHT: (C)2007,JPO&INPIT
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