发明名称 |
PROCESS FOR POLISHING GLASS SUBSTRATE |
摘要 |
A process for polishing a glass substrate, which enables to polish a glass substrate having a large waviness formed by mechanical polishing, to have a surface excellent in flatness, is provided. A process for polishing a glass substrate, comprising a step of measuring the surface profile of a mechanically polished glass substrate to identify the width of waviness present in the glass substrate, and a step of applying dry etching using a beam having a beam size in FWHM (full width of half maximum) value of at most the above size of waviness, to polish the surface of the glass substrate. |
申请公布号 |
WO2006082751(A3) |
申请公布日期 |
2006.10.26 |
申请号 |
WO2006JP301257 |
申请日期 |
2006.01.20 |
申请人 |
ASAHI GLASS COMPANY, LIMITED;OTSUKA, KOJI;ITO, MASABUMI;KOJIMA, HIROSHI |
发明人 |
OTSUKA, KOJI;ITO, MASABUMI;KOJIMA, HIROSHI |
分类号 |
C03C15/02 |
主分类号 |
C03C15/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|