| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve such a problem that inspection equipment for a wafer is enlarged and such a problem that a manufacturing cost of the inspection equipment itself for the wafer increases, and to make it easier to take out and take in the wafer to be inspected, in the inspection equipment for the wafer which images the circumferential edge of the wafer and preferably inspects whether any abnormality exists in the wafer or not. <P>SOLUTION: The inspection equipment 1 for the wafer includes a supporter for supporting a wafer W on a horizontal plane, and an imaging camera 51 for imaging a circumferential edge Wf of the wafer W supported by the supporter. In the inspection equipment, there is provided an arcuately extending R guide 30 so as to exist on a longitudinal cross section including a center axis line G of the wafer W, and so as to front on the circumferential edge Wf to be imaged of the wafer W; and the imaging camera 51 is moved while being guided by the R guide 30 and images the circumferential edge Wf of the wafer W. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
