| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for an optical wiring which has a coefficient of thermal expansion which differs a little from that of an electrical wiring board, a processing temperature which is near to that for an electrical wiring board and a small light propagation loss, and which is suitable for compositing with the electrical wiring board; and a substrate for a photo-electrical composite wiring. SOLUTION: This resin composition for an optical wiring comprises an inorganic filler having an average particle diameter of 1 nm or more and 100 nm or less and a resin, and is a resin composition in which the ratio n<SB>f</SB>/n<SB>r</SB>of the refractive index n<SB>f</SB>of the inorganic filler to the refractive index n<SB>r</SB>of the resin is 0.8 or more and 1.2 or less, wherein the resin composition has a coefficient of thermal expansion of -1×10<SP>-5</SP>/°C or more and 4×10<SP>-5</SP>/°C or less, a true temperature dependency of the refractive index at -20°C to 90°C is -1×10<SP>-4</SP>/°C or more and 1×10<SP>-4</SP>/°C or less, and has substantially no light absorbance at a wavelength of 0.6μm to 0.9μm or 1.2μm to 1.6μm. COPYRIGHT: (C)2007,JPO&INPIT |
