发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit in which a plurality of circuits whose demanded values for circuit working speed and leakage current values are different are integrated on the same chip, and to provide a method of manufacturing it. SOLUTION: The semiconductor integrated circuit includes a low-speed circuit 120 arranged on a rectangular low-seed circuit region 12 and configured by a low-speed transistor which makes a first diffusion region of a source extension region and a drain extension region, and a high-speed circuit 110 arranged on the rectangular high-speed circuit region 11 which adjoins the low-speed circuit region 12 and configured by a high-speed transistor which makes a second diffusion region with a thickness thinner than the first diffusion region of a source extension region and a drain extension region. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006294751(A) 申请公布日期 2006.10.26
申请号 JP20050111195 申请日期 2005.04.07
申请人 TOSHIBA CORP 发明人 IINUMA TOSHIHIKO
分类号 H01L21/8234;H01L21/265;H01L27/088;H01L27/10 主分类号 H01L21/8234
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