| 摘要 |
PROBLEM TO BE SOLVED: To reduce frictional resistance accompanied by contact between an expand tape and an expand ring in an expand step for expanding the expand tape stuck on a semiconductor integrated circuit when the semiconductor integrated circuit is separated into individual chips. SOLUTION: When a high-pressure blow groove 51 is formed in a contact with an expand tape 11 in an expand ring 15, and the expand tape 11 is radially extended; a high-pressure blow 52 is fed to the contact between the expand ring 15 and the expand tape 11 during expanding, thereby forming a clearance at the contact. Thus, frictional resistance between the expand ring 15 and the expand tape 11 is reduced to the minimum, the expand tape 11 is protected when it is radially extended, and the variance of a clearance is reduced between the expand tape 11 and the chip. COPYRIGHT: (C)2007,JPO&INPIT |
