发明名称 HEATSINK APPARATUS FOR ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heatsink apparatus for an electronic device, which can maintain a uniform flow rate of a heat absorbing fluid so that the temperature of a surface that is brought into contact with the electronic device is constant. SOLUTION: A heatsink apparatus for an electronic device comprises: a body having an inlet, an outlet, and multiple channels through which a heat absorbing fluid flows; an inflow guide portion which has a cross section becoming smaller with increasing distance from the inlet and guides the heat absorbing fluid so that the heat absorbing fluid flows into each of the multiple channels at a uniform flow rate; and an outflow guide portion that has the same shape as that of the inflow guide portion and, together with the inflow guide portion, guides the heat absorbing fluid so that the heat absorbing fluid flows through each of the multiple channels at a uniform flow rate. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006295178(A) 申请公布日期 2006.10.26
申请号 JP20060106811 申请日期 2006.04.07
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 PARK HEE-SUNG;KIM KWANG;KANG JONG-TAE
分类号 H01L23/473;H05K7/20 主分类号 H01L23/473
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