发明名称 APPARATUS AND METHOD FOR FORMING OXIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method for forming an oxide film wherein a high-quality oxide film can be formed and management is facilitated. SOLUTION: A vaporizer 21 provided externally to a pressure-resistant container 13 generates water vapor, which is in turn supplied into warmed and pressurized the pressure-resistant container 13. Therefore, the atmosphere around a silicon wafer A is constant throughout all the steps of an oxide film formation process, and an oxide film formed over the silicon wafer A is of high quality. Since water is used, the management of a quantity consumed and safe management are facilitated. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006295020(A) 申请公布日期 2006.10.26
申请号 JP20050116529 申请日期 2005.04.14
申请人 SCI TECHNOL KK 发明人 YOSHIMURA TOSHIAKI;OGAWA YOSHIAKI;MINOWA HIROYUKI;MORII MITSURU;NAITO YASUSHI
分类号 H01L21/31;C23C16/40;C23C16/448;H01L21/316 主分类号 H01L21/31
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