发明名称 Method for manufacturing semiconductor device
摘要 A semiconductor manufacturing apparatus A semiconductor manufacturing apparatus comprises a hot plate which heats a sapphire substrate; a support table having a support plate disposed with being spaced away from the hot plate by a predetermined interval, and support portions which respectively support the sapphire substrate with being spaced by a predetermined interval between the hot plate and the support plate and support the sapphire substrate in such a manner that back surfaces of the hot plate and the sapphire substrate are opposite to each other; an elevating device which moves the support table up and down; and a shielding cover which externally blocks off spacing defined between the hot plate and the sapphire substrate and spacing defined between the sapphire substrate and the support plate.
申请公布号 US2006240574(A1) 申请公布日期 2006.10.26
申请号 US20060405569 申请日期 2006.04.18
申请人 YOSHIE TORU 发明人 YOSHIE TORU
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
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