| 摘要 |
PROBLEM TO BE SOLVED: To fully prevent light from entering into surroundings of a photodiode while fully suppressing impedances of all wiring layers, when plural wiring layers consisting of a metal material are provided on the upper layer of the photodiode in a solid imaging element. SOLUTION: A first aluminum wiring 50 and a second aluminum wiring 60 are formed on an upper layer of a silicon substrate 30 on which plural photodiodes 26 are formed. Furthermore, on the upper layer there is provided an uppermost layer metal shading film 22 which shades a light to surroundings of the photodiodes 26. There is provided a contact 70 for electrically connecting the uppermost layer metal shading film 22 with the second aluminum wiring 60. The uppermost layer metal shading film 22 shows a lower reflection factor as compared with a lower layer aluminum wiring. The contact 70 consists of the same material as the uppermost layer metal shading film 22, and is formed so as to be directly connected with the uppermost layer metal shading film 22. COPYRIGHT: (C)2007,JPO&INPIT
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