| 摘要 |
PROBLEM TO BE SOLVED: To enable to connect an IC terminal and a die pad of which a rear face is exposed can be connected at a shortest distance in a package in which the pad is exposed on the rear face of the IC. SOLUTION: This is arranged in a recess, in which a by-pass capacitor can be housed between pins that make the IC and a pattern of a printed-circuit board contact so that the IC terminal and the die pad are connected by contacting of the by-pass capacitor that is arranged between the pins with a conductive sheet, when the IC is pressed toward the printed circuit board side. COPYRIGHT: (C)2007,JPO&INPIT
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