| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropically conductive adhesive having excellent storage stability and excellent low temperature short time connectivity. SOLUTION: This anisotropically conductive adhesive containing (a) an epoxy resin, (b) a microcapsulated imidazole derivative epoxy compound, and (c) conductive particles as essential components is characterized in that a resin flow coefficient is 1.5 to 3, and tack after left at 40°C for three days is≥70% of the tack before left. COPYRIGHT: (C)2007,JPO&INPIT
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