发明名称 DIELECTRIC FILM WITH LOW COEFFICIENT OF THERMAL EXPANSION (CTE) USING LIQUID CRYSTALLINE RESIN
摘要 An embodiment of the present invention is a technique to provide a dielectric film material with a controllable coefficient of thermal expansion (CTE). A first compound containing a first liquid crystalline component is formed. The first compound is cast into a first film. The first film is oriented in an magnetic or electromagnetic field in a first direction. The first film is cured at a first temperature.
申请公布号 WO2006012113(A3) 申请公布日期 2006.10.26
申请号 WO2005US21903 申请日期 2005.06.20
申请人 INTEL CORPORATION;MATAYABAS, JAMES, C., JR. 发明人 MATAYABAS, JAMES, C., JR.
分类号 H01L21/56;H01L21/768;H01L23/532;H05K3/46 主分类号 H01L21/56
代理机构 代理人
主权项
地址