| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To resolve physical properties required for a polishing solution for metal in order to allow a high polishing rate to be compatible with favorable dishing performance, and provide the polishing solution for metal with the physical properties attained, and a polishing method using the same. <P>SOLUTION: A polishing solution for metal contains an oxidant. In the polishing solution for metal, E1/E2 is 1.5 or more, when expressing an oxidation reaction rate immediately after the metal surface to be polished starts to be oxidized as E1 and the oxidation reaction rate at the time when the oxidation reaction reaches a stationary state as E2. Moreover, the time required for reaching the oxidation reaction rate of (E1+E2)/2 is 1 to 50 seconds. There is provided a polishing method using the same. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
