发明名称 THERMAL INTERFACE MATERIAL AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermal interface material having low heat transfer resistance on a heat transfer interface to exhibit high heat conductivity even at a low pressure in packaging and a method of manufacturing the same. SOLUTION: A thermal interface material is provided with a matrix including a first surface and an opposite second surface and a plurality of carbon nanotubes extending from the first surface to the second surface. The plurality of carbon nanotubes are exposed out of one of the first and second surfaces of the matrix. A phase change layer is formed on the surface where the plurality of the carbon nanotubes are exposed. A part of the the carbon nanotubes exposed out of the surface is elastically bent and embedded in the matrix and a certain pressure is applied on the contact surface by causing the spring back in use to form a more tight contact surface. The method of manufacturing the heat conductive material is provided. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006290736(A) 申请公布日期 2006.10.26
申请号 JP20060109204 申请日期 2006.04.11
申请人 KOFUKIN SEIMITSU KOGYO (SHENZHEN) YUGENKOSHI;QINGHUA UNIV 发明人 KO KA;RYU CHOKO;FAN FENG-YAN
分类号 C01B31/02;H01L23/373 主分类号 C01B31/02
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