| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thick-film conductive composition capable of forming an electrode having a sufficient strength of adhesion while suppressing the occurrence of cracks. <P>SOLUTION: A thick-film conductive composition including (a) metal particles selected from Cu, Au, Ag, Pd, and Pt, their alloys, and their mixture, (b) glass particles, and (c) an organic vehicle, wherein the components (a) and (b) are dispersed in the component (c) and the average particle size of the metal particles is in a range of 3.0 to 15.0μm. This composition can be used for formation of an electrode to connect the backside terminal on the silicon substrate of a solar cell. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
