发明名称 TRANSFER FORMING METHOD OF PACKAGED BODY IN PACKAGED SOLID ELECTROLYTIC CAPACITOR
摘要 PROBLEM TO BE SOLVED: To reduce the occurrence of non-conforming articles when performing transfer formation for filling a cavity C for formation provided in a pair of molds B1, B2 for forming with a molten resin to form a package body 4 that seals a capacitor element 3 and is made of a synthetic resin. SOLUTION: A reservoir chamber C' communicating with the inside of the cavity for forming via gates K, L is provided in one or both of the molds. The filling of the molten resin is stopped when the molten resin is injected into one portion of the reservoir chamber. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006294690(A) 申请公布日期 2006.10.26
申请号 JP20050109917 申请日期 2005.04.06
申请人 ROHM CO LTD 发明人 NAKAMURA TAKAHIRO
分类号 H01G9/00;H01G9/08 主分类号 H01G9/00
代理机构 代理人
主权项
地址