发明名称 |
Positive type photosensitive epoxy resin composition and printed circuit board using the same |
摘要 |
A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.
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申请公布号 |
US2006240356(A1) |
申请公布日期 |
2006.10.26 |
申请号 |
US20060471871 |
申请日期 |
2006.06.21 |
申请人 |
HUNTSMAN ADVANCED MATERIALS AMERICAS INC. |
发明人 |
SUGANO YASUAKI;NOJIMA YASUHARU |
分类号 |
G03C1/00;G03F7/004;C08G59/62;G03F7/032;G03F7/038;G03F7/039;H05K1/03;H05K3/28;H05K3/46 |
主分类号 |
G03C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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