| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing method for sealing a board having a plurality of semiconductor devices mounted thereon which method enables molding ensuring a given mold height and mold size even if a resin of a low viscosity is used, and reduces voids by applying pressure on a mold resin to offer a highly reliable semiconductor device. SOLUTION: Heated upper and lower dies 1, 2 are provided. A board 10 having a semiconductor chip 8 mounted thereon is supplied to the lower die 2, and a plate 11 having a through-hole is overlaid on the lower die 2 and the board 10 to form a cavity 12. A trench 13 and a second through-hole 14 formed on the plate 11 form a spare cavity. Then, a mold resin 15 is supplied directly into the cavity 12, and the dies 1, 2 are completely closed after depressurizing the inside of the dies to fill the cavity 12 with the resin 15 while causing the excess sealing resin 15 to flow into the spare cavity. Subsequently, the bottom 5 of the spare cavity 12, which can be controlled by pressure, is raised to apply pressure to the resin 15 to mold it. COPYRIGHT: (C)2007,JPO&INPIT |
