| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure with high electric reliability of an electronic component in which especially non-lead solder is used in the soldered electronic component. SOLUTION: The electronic component having a conductive pad 1 around a lead 2 on the lower face of the cabinet 3 of the electronic component is soldered to a printed wiring board 5. Thus, the conductive pad 1 and a through-hole 4 are connected by a solder fillet 9. Since stress generated at the time of a mounting process is absorbed by the connected fillet 9, stress on a through-hole corner becomes small, and occurrence of a through-hole corner crack can be suppressed. COPYRIGHT: (C)2007,JPO&INPIT
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