| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounting electronic part which prevents the pressure buildup of the internal space of a main electronic part in a packaging process, and which can make the internal space of the main electronic part into the state wherein a hermetic seal is performed after packaging, and also to provide a method of packaging it and a packaging structure. SOLUTION: A through-hole 20 which communicates with an internal space 2b is arranged to the region in which the external electrode 5(5a) of the main electronic part 8 is formed. The main electronic part 8 is formed by joining the package 2 and a lid (optical filter) 3 with adhesion or welding, and the through-hole 20 which communicates with the internal space 2b is arranged in the region in which the external electrode 5 of the package 2 is formed. An infrared sensor element is contained in the package, and the opening 2a of the package is sealed by a lid (optical filter) 3 configured to carry out the function of the infrared sensor to receive infrared rays of a predetermined wavelength, and the opening 2a of the package is sealed. COPYRIGHT: (C)2007,JPO&INPIT
|
