| 摘要 |
<p>A polyamide resin composition for reflectors which gives a molding having high mechanical strength and excellent heat resistance and stably having a high reflectance and can give a reflector reduced in the decrease in reflectance caused by heating especially in an LED production step or reflow soldering step; and a reflector obtained by molding the resin composition. The polyamide resin composition for reflectors comprises 30-80 mass% polyamide resin (A), 10-60 mass% inorganic filler (B), and 5-50 mass% white pigment (C) (provided that the sum of A, B, and C does not exceed 100 mass%), and is characterized in that the polyamide resin (A) comprises: dicarboxylic acid ingredient units (a-1) comprising 30-100 mol% dicarboxylic acid ingredient units derived from terephthalic acid and 0-70 mol% units derived from an aromatic dicarboxylic acid ingredient excluding terephthalic acid and/or 0-70 mol% units derived from a C<SUB>4-20</SUB> aliphatic dicarboxylic acid ingredient; and diamine ingredient units (a-2) comprising units derived from a C<SUB>4-20</SUB> linear aliphatic diamine ingredient and/or units derived from an aliphatic diamine ingredient having a C<SUB>4-20</SUB> side chain. The composition is further characterized in that the polyamide resin (A) has a terminal amino group concentration of 70-230 mmol/kg.</p> |
