首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Verfahren zum Zertrennen von Wafern in Einzelchips
摘要
申请公布号
DE69736646(D1)
申请公布日期
2006.10.26
申请号
DE19976036646
申请日期
1997.07.09
申请人
NEC CORPORATION
发明人
ISHIDA, HISASHI
分类号
H01L21/78;H05K3/00;H01L21/268;H01L21/301;H01L21/304;H05K3/46
主分类号
H01L21/78
代理机构
代理人
主权项
地址
您可能感兴趣的专利
FILTER
AIR SET STAND
METHOD OF ELECTRIC RESISTANCE WELDING
(A) ;PREPARATION OF AAALKYLTHIOACETIC ACID DERIVATIVES
MULTIPLEX DATA PROCESSING SYSTEM
POWER SOURCE MEANS FOR MAGNETRON
ANORDNING FOR } UTVIDE OG FORME MINDRE, VERTIKALE ELLER STERKT SKR}NENDE SJAKTER
Termohædnende overtrækningsmateriale på basis af en copolymer af en ester af en ethylenisk umættet carboxylsyre.
IMPROVEMENTS IN THE PRODUCTION OF CANE SUGAR
VERSNELLINGSNAAF VOOR RIJWIELEN, BROMFIETSEN OF DERGELIJKE.
METHOD OF STABILIZING DEPTH OF HIGHLY AGITATED SOLID PARTICLE FLUID LAYER
GAS PHASE GROWN UNIT FOR CHEMICAL COMPOUND SEMICONDUCTOR
TORSION RATE MEASURING UNIT FOR COLOR BROWN TUBE ELECTRONIC GUN
SIGNAL RECEPTION AND TRANSMISSION CRICUIT FOR EXCHANGER
COATED CUTTING CHIP MADE OF HARD ALLOY
OVERHEAT DISPLAY UNIT
METHOD OF PRODUCING THICK MULTILAYER CIRCUIT SUBSTRATE
METHOD OF MAKING RESISTORS
ELECTRIC INSULATING OIL COMPOSITION
DIGITAL HEMADYNAMOMETER
