| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of ensuring the sufficient heat dissipation characteristics and improving the mounting reliability, and its manufacturing method. <P>SOLUTION: The semiconductor device incorporates a heat sink (11) with at least one or more notches (5a and 5b), a lead frame (15) comprising many inner leads (3i), a semiconductor element (4) mounted on the heat sink (11), a bonding pad (7) attached on this semiconductor element (4), and a resin for sealing a wire (2) used for electrical connection of the inner leads (3i). <P>COPYRIGHT: (C)2007,JPO&INPIT |
