发明名称 REFLOW SOLDERING MACHINE
摘要 PROBLEM TO BE SOLVED: To provide a reflow soldering machine wherein a large amount of an evaporative components of flux contained in solder produced accompanied by with reflow are effectively decomposed by a catalyzing body. SOLUTION: The catalyzing body 77 that decomposes flux present in atmospheric gas in a reflow furnace is disposed in contact with the heat radiation surface of a radiation panel 75. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006295024(A) 申请公布日期 2006.10.26
申请号 JP20050116616 申请日期 2005.04.14
申请人 OANESU:KK 发明人 KAWAGUCHI YOSUKE
分类号 H05K3/34;B23K1/005;B23K1/008;B23K101/42;F27B9/06;F27B9/10;F27D11/02 主分类号 H05K3/34
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