| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device structured to use a lead of a lead frame as an internal wire of a package, having a simple process and capable of reducing cost, and to provide its manufacturing method. SOLUTION: The lead 10 is provided along the outer periphery of a semiconductor chip 11. The semiconductor chip 11 and the lead 10 are connected via a wire bonding part 13. The semiconductor chip 11, the lead 10 and the wire bonding part 13 are sealed with resin layers (14, 15 and 17). A lead opening C1 is further provided on the resin layers to reach the lead 10. Extraction electrodes (21a and 22a) are embedded in the lead opening. COPYRIGHT: (C)2007,JPO&INPIT
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