发明名称 CONTACT ARRANGEMENT SUITABLE FOR MEMORY ARRAY, AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a contact arrangement that can lower the resistance of a selective transistor line and a source line in a NAND type flash memory array, and its manufacturing method. SOLUTION: The manufacturing method for a contact arrangement includes the steps of forming a substrate on whose main surface 1 a tunnel dielectric layer 6 is stacked, wherein a first conductive line extends onto the tunnel dielectric layer 6 in a first direction and is set in place, stacking a dielectric material's layer to the first conductive line, stacking a control gate layer 10, patterning the first conductive line and forming a gate lamination layer 20, stacking dielectric materials between the gate lamination layer 20, partially removing the gate lamination layer 20 and exposing a floating gate electrode 9 in a region where a selective transistor line 24 is formed, thereby forming a selective transistor line groove 23 that extends in a second direction, and filling the selective transistor line groove 23 with a conductive material to form the selective transistor line 24. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006295185(A) 申请公布日期 2006.10.26
申请号 JP20060108686 申请日期 2006.04.11
申请人 INFINEON TECHNOLOGIES AG 发明人 WILLER JOSEF
分类号 H01L21/8247;H01L21/3205;H01L27/115;H01L29/423;H01L29/49;H01L29/788;H01L29/792 主分类号 H01L21/8247
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