| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device package manufacturing method which can perform resistance-welding with a heat sink of single structure as a joining material. SOLUTION: The semiconductor device package manufacturing method includes a process to join a heat sink 6 to a base 1 formed of a thin metal sheet. The heat sink 6 is formed of a metal of the electric conductivity and heat conductivity higher than those of the base 1, and the method has a joining process which sandwiches the base 1 and heat sink 6 using a pair of welding electrodes 8a, 8b, and presses them while turning on the electric current through them in a state that the heat sink 6 is mounted on one side of the base 1. COPYRIGHT: (C)2007,JPO&INPIT
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