| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer structure circuit board capable of securing conduction between an end electrode and a land electrode even when there occurs conduction failure at a junction between a side through hole and the land electrode communicating with the same, when dividing a plurality of circuit board blocks formed on a multilayer structure insulator sheet along a circuit board block into individual circuit boards. SOLUTION: The insulator sheet 1 is divided into two longitudinally of the side through hole 4 along a division groove 3. The structure is constituted in such a way that a blind via hole 7 connects an interlayer conductor 6 connected with the side through-hole 4 provided in the insulator sheet 1 and the land electrode 5b joined with the side trough hole 4 provided in the surface of the insulator sheet 1. COPYRIGHT: (C)2007,JPO&INPIT
|
