| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid ejecting head which enables prevention of entry into a nozzle part of a chip mounting adhesive, and to provide a method of manufacturing a liquid ejecting head. SOLUTION: A bank is formed in the periphery of an ink supply port of a chip rear face by high mull. In the liquid ejecting head and the method of manufacturing the liquid ejecting head, the chip mounting adhesive is prevented from entering the ink supply port by the action of the bank when a chip and a chip plate are bonded. COPYRIGHT: (C)2007,JPO&INPIT
|
