发明名称 Printed circuit board for improving impedance of signal transmission lines
摘要 A printed circuit board includes a first ground layer and a second ground layer. The second ground layer is below the first ground layer. A signal transmission line is arranged on the printed circuit board. The first ground layer includes a chamber located below the transmission line. Therefore, the signal transmission line takes the second ground layer as a reference ground layer, so impedance of the signal transmission line is increased.
申请公布号 US2006237322(A1) 申请公布日期 2006.10.26
申请号 US20060377142 申请日期 2006.03.16
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 HSU SHOU-KUO
分类号 C25D5/02 主分类号 C25D5/02
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