摘要 |
<p>An IC assembly (10) having a die mounted on a substrate (16) with a gap therebetween, receives underfill material (12) through an aperture (32) provided in the substrate to fill the gap. This provides a favorable flow rate and improved underfilling, with less voiding. Embodiments of the invention are disclosed in which capillary action, a vacuum, or positive pressure, are used to assist the flow of underfill material.</p> |
申请人 |
TEXAS INSTRUMENTS INCORPORATED;ODEGARD, CHARLES, ANTHONY;COWENS, MARVIN, WAYNE;STIBOREK, LEON |
发明人 |
ODEGARD, CHARLES, ANTHONY;COWENS, MARVIN, WAYNE;STIBOREK, LEON |