| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable wiring structure, especially a contact structure, for further micronization and higher sensitivity. <P>SOLUTION: The semiconductor device comprises a pad for external connection. The pad comprises: a first layer pad 3ap whose surface is flat and consists of a first layer conductive film; a second layer pad 3bp of such pattern form as to comprise a rough pattern on its surface on the first layer pad; and a metal pad 9p for bonding which reflects the rough pattern on the second layer pad to have a rough surface. <P>COPYRIGHT: (C)2007,JPO&INPIT |
