| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an integrated circuit packaging process through a non-tape die attaching method that can reinforce die attaching strength to avoid separation of chips from a substrate. <P>SOLUTION: The integrated circuit packaging process includes the steps of providing a substrate having a top surface, a bottom surface, and an aperture (step 1), applying a liquid die attaching material to the top surface of the substrate (step 2), carrying out a defoaming operation to exclude fine bubbles in the liquid die attaching material (step 3), carrying out a first annealing operation to change the liquid die attaching material to be half-cured and form a compact die attaching film (step 4), exposing multiple bonding pads to the aperture that are used for the compact die attaching film to bond the active surface of the chip to the top surface of the substrate, and have multiple bonding pads on the active surface of the chip (step 5), and performing a second annealing operation to cure up the compact die attaching film (step 6). <P>COPYRIGHT: (C)2007,JPO&INPIT |
