| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink of a PA (Power Amplifier) module which is easily separated into scraps and recycling products. SOLUTION: By showing the type of solder to be used, the melting point, and the type of plating on the surface of the heat sink, the type of plating of the heat sink and its melting point and the type of solder to be used are known at a glance. Hence, in assembling, setting errors of the reflow furnace temperature for joining the heat sink to a substrate are eliminated, and the setting conditions for the reflow furnace temperature are determined easily. When disposing the heat sink, the type of solder used is identified, which makes the heat sink available for separated disposal. COPYRIGHT: (C)2007,JPO&INPIT |
